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RAISE3D N2 Plus Dual

RAISE3D N2 Plus Dual slicer settings

Recommended slicer settings for the RAISE3D N2 Plus Dual (Raise3D) 3D printer. Profiles cover PLA, ABS, HIPS, WOOD, TPU with starting nozzle/bed temperatures, fan, and speed guidance. Build volume 305x305x610. Fused Deposition Modeling (FDM / FFF). Common slicers: ideaMaker. Use these as a baseline and fine-tune for your filament brand and enclosure.

PLAABSHIPSWOODTPU

RAISE3D N2 Plus Dual slicer settings

Starting temps and speeds for this machine. Generated defaults are a baseline — tune for your filament.

Profile Filament Temp Speed Fan Slicer
RAISE3D N2 Plus Dual — ABS starting settings defaults ABS 250/100 150 mm/s 0-20 ideaMaker
RAISE3D N2 Plus Dual — HIPS starting settings defaults HIPS 240/100 150 mm/s 20-40 ideaMaker
RAISE3D N2 Plus Dual — PLA starting settings defaults PLA 210/60 150 mm/s 100 ideaMaker
RAISE3D N2 Plus Dual — TPU starting settings defaults TPU 230/40 150 mm/s 50-80 ideaMaker
RAISE3D N2 Plus Dual — WOOD starting settings defaults WOOD 200/60 150 mm/s 100 ideaMaker

Tech specs

Type Home
Brand Raise3D
Сountry USA
Print technology Fused Deposition Modeling (FDM / FFF)
Nozzle quantity 2
Print speed 10-150 mm / s
LCD Screen Yes
Print Area 305x305x610
Bed Heated
Material ABS, PLA, Hips, Flex, Wood
Material diameter 1.75
Host computer software ideaMaker
Input method USB, Card Reader, WiFi, Ethernet
Machine size 305x305x610
weight, kg 48.5 kg

This table outlines the technical specifications and parameters for the Raise3D N2 Plus Dual 3D printer for home use. It is manufactured in the USA and utilizes Fused Deposition Modeling (FDM / FFF) with two nozzles. It has a print speed of 10-150 mm/s, a print area of 305x305x610, heated bed, and supports a variety of materials with a diameter of 1.75 mm. Input is supported via USB, Card Reader, WiFi, or Ethernet, with a host computer software of ideaMaker. The machine size is 305x305x610, and it weighs 48.5 kg.